C. Ryu

Kinetics of copper drift in low-κ polymer interlevel dielectrics

Alvin L. S. Loke, J. T. Wetzel, P. H. Townsend et al. · IEEE Transactions on Electron Devices · 1999 · 135 citations

Materials Science, Materials Engineering, Electrical Engineering +13

Homocysteinemia is Associated with the Presence of Microbleeds in Cognitively Impaired Patients

Jun Sang Yoo, C. Ryu, Young Seo Kim et al. · Journal of Stroke and Cerebrovascular Diseases · 2020 · 15 citations

Alzheimer's Disease, Cognitively Impaired Patients, Dementia +5

Experimental comparison of wafer level reliability (WLR) and packaged electromigration tests

C. Ryu, T.-L. Tsai, A.M. Rogers et al. · 2002 · 13 citations

Engineering, Industrial Engineering, Electromigration Tests +16

Microstructure And Mechanical Properties Of Electroplated Cu Films For Damascene Ulsi Metallization

Valery M. Dubin, G. Morales, C. Ryu et al. · MRS Proceedings · 1997 · 12 citations

Materials Engineering, Materials Science, Electromigration Technique +9

Barrier/seed layer requirements for copper interconnects

S.S. Wong, C. Ryu, H. Lee et al. · 2002 · 10 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +18