Ming‐Shiann Feng

Statistics

Publications

Citations

526

H-Index

Active since

1995

Affiliations

National Yang Ming Chiao Tung University(Current)

National Institutes of Applied Research

Kanto Chemical (Japan)

Taiwan Semiconductor Manufacturing Company (Taiwan)

National Cheng Kung University

Ming‐Shiann Feng is an author at National Yang Ming Chiao Tung University specializing in materials science, materials engineering, and natural sciences.

Publications per year

1995–2005

Publications

The Effect of Plating Current Densities on Self-Annealing Behaviors of Electroplated Copper Films

Shih-Chieh Chang, Jia‐Min Shieh, Bau‐Tong Dai et al. · Journal of The Electrochemical Society · 2002 · 69 citations

Natural Sciences, Materials Engineering, Materials Science +16

Investigations of effects of bias polarization and chemical parameters on morphology and filling capability of 130 nm damascene electroplated copper

Shih-Chieh Chang, Jia‐Min Shieh, Kun-Cheng Lin et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2001 · 41 citations

Natural Sciences, Materials Engineering, Materials Science +17

The application of electrochemical metrologies for investigating chemical mechanical polishing of Al with a Ti barrier layer

Shao-Yu Chiu, Ying-Lang Wang, Chuan-Pu Liu et al. · Materials Chemistry and Physics · 2003 · 37 citations

Natural Sciences, Materials Engineering, Materials Science +16

Characterization of additive systems for damascene Cu electroplating by the superfilling profile monitor

Shao-Yu Chiu, Jia‐Min Shieh, Shih-Chieh Chang et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2000 · 37 citations

Natural Sciences, Materials Engineering, Materials Science +17

High-selectivity damascene chemical mechanical polishing

Shao-Yu Chiu, Ying-Lang Wang, Chuan‐Pu Liu et al. · Thin Solid Films · 2005 · 34 citations

Engineering, Chemical Engineering, Materials Science +6

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