Kun-Cheng Lin

Intelligent agents for e-marketplace: Negotiation with issue trade-offs by fuzzy inference systems

Chi-Bin Cheng, Chu-Chai Henry Chan, Kun-Cheng Lin · Decision Support Systems · 2005 · 106 citations

Fuzzy Inference Systems, Negotiation, Electronic Marketplace +14

Investigations of effects of bias polarization and chemical parameters on morphology and filling capability of 130 nm damascene electroplated copper

Shih-Chieh Chang, Jia‐Min Shieh, Kun-Cheng Lin et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2001 · 41 citations

Environmental Electrochemistry, Engineering, Electrode-electrolyte Interface +18

Characterization of additive systems for damascene Cu electroplating by the superfilling profile monitor

Shao-Yu Chiu, Jia‐Min Shieh, Shih-Chieh Chang et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2000 · 37 citations

Engineering, Electrode-electrolyte Interface, Chemistry +21

Wetting effect on gap filling submicron damascene by an electrolyte free of levelers

Shih-Chieh Chang, Jia‐Min Shieh, Kun-Cheng Lin et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2002 · 23 citations

Materials Science, Chemical Engineering, Electrolyte Free +14

Electroplating copper in sub-100 nm gaps by additives with low consumption and diffusion ability

Kun-Cheng Lin, Jia‐Min Shieh, Shih-Chieh Chang et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2002 · 11 citations

Materials Science, Materials Engineering, Chemical Engineering +15