Antti Rautiainen

Microstructural Characterization and Mechanical Performance of Wafer-Level SLID Bonded Au-Sn and Cu-Sn Seal Rings for MEMS Encapsulation

Antti Rautiainen, Hongbo Xü, Elmeri Österlund et al. · Journal of Electronic Materials · 2015 · 39 citations

Materials Science, Engineering, Advanced Packaging (Semiconductors) +13

Diamond-like carbon (DLC) thin film bioelectrodes: Effect of thermal post-treatments and the use of Ti adhesion layer

Tomi Laurila, Antti Rautiainen, Sakari Sintonen et al. · Materials Science and Engineering C · 2013 · 33 citations

Materials Science, Diamond-like Carbon, Engineering +4

Wafer-Level AuSn/Pt Solid–Liquid Interdiffusion Bonding

Antti Rautiainen, Vesa Vuorinen, H. Heikkinen et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 18 citations · Full text

Materials Science, Materials Engineering, Mems Devices +15

Improving the function of dopamine electrodes with novel carbon materials

Emilia Kaivosoja, Emilia Berg, Antti Rautiainen et al. · 2013 · 15 citations

Reliability performance of Au-Sn and Cu-Sn wafer level SLID bonds for MEMS

Hongbo Xü, Antti Rautiainen, Vesa Vuorinen et al. · 2014 · 10 citations