H. Heikkinen

Nanoelectronic primary thermometry below 4 mK

D. I. Bradley, Roy George, D. Gunnarsson et al. · Nature Communications · 2016 · 53 citations · Full text

Engineering, Electrical Engineering, Physics +15

Wafer-level SLID bonding for MEMS encapsulation

Heng Xu, Tommi Suni, Vesa Vuorinen et al. · Advances in Manufacturing · 2013 · 44 citations · Full text

Engineering, Materials Engineering, Materials Science +14

An XPS study of SrS:Ce thin films for electroluminescent devices

H. Heikkinen, Leena‐Sisko Johansson, E. Nykänen et al. · Applied Surface Science · 1998 · 42 citations

Natural Sciences, Materials Engineering, Materials Science +11

Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies

Kai Zoschke, Charles-Alix Manier, Martin Wilke et al. · 2013 · 27 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Deposition of lanthanum sulfide thin films by atomic layer epitaxy

Kaupo Kukli, H. Heikkinen, E. Nykänen et al. · Journal of Alloys and Compounds · 1998 · 26 citations

Natural Sciences, Materials Engineering, Materials Science +12