Lei Han

Study on a cooling system based on thermoelectric cooler for thermal management of high-power LEDs

Junhui Li, Bangke Ma, Ruishan Wang et al. · Microelectronics Reliability · 2011 · 138 citations

Electrical Engineering, Engineering, Thermoelectric Cooler +12

Interfacial Microstructures and Thermodynamics of Thermosonic Cu-Wire Bonding

Junhui Li, Liu Linggang, Luhua Deng et al. · IEEE Electron Device Letters · 2011 · 83 citations

Materials Science, Materials Engineering, High Temperature Materials +14

Dynamics Features of Cu-Wire Bonding During Overhang Bonding Process

Li Junhui, Liu Linggang, Bangke Ma et al. · IEEE Electron Device Letters · 2011 · 46 citations

Engineering, Severe Plastic Deformation, Interconnect (Integrated Circuits) +16

Interfacial Characteristics and Dynamic Process of Au- and Cu-Wire Bonding and Overhang Bonding in Microelectronics Packaging

Junhui Li, Xiaolong Zhang, Liu Linggang et al. · Journal of Microelectromechanical Systems · 2013 · 37 citations

Engineering, Severe Plastic Deformation, Microelectronics Packaging +18

Graph-guided multi-task sparse learning model: a method for identifying antigenic variants of influenza A(H3N2) virus

Lei Han, Lei Li, Feng Wen et al. · Bioinformatics · 2018 · 28 citations · Full text