Concepedia

Liu Linggang

LL

Statistics

Publications

4

Citations

182

H-Index

4

Active since

2011

Affiliations

Central South University(Current)

State Key Laboratory of High Performance Complex Manufacturing

Liu Linggang is an author at Central South University specializing in materials science, materials engineering, and bonding.

Publications per year

2011–2013

4

Publications

4

Interfacial Microstructures and Thermodynamics of Thermosonic Cu-Wire Bonding

Junhui Li, Liu Linggang, Luhua Deng et al. · IEEE Electron Device Letters · 2011 · 83 citations

Natural Sciences, Materials Engineering, Materials Science +17

Dynamics Features of Cu-Wire Bonding During Overhang Bonding Process

Li Junhui, Liu Linggang, Bangke Ma et al. · IEEE Electron Device Letters · 2011 · 46 citations

Natural Sciences, Materials Engineering, Materials Science +16

Interfacial Characteristics and Dynamic Process of Au- and Cu-Wire Bonding and Overhang Bonding in Microelectronics Packaging

Junhui Li, Xiaolong Zhang, Liu Linggang et al. · Journal of Microelectromechanical Systems · 2013 · 37 citations

Natural Sciences, Materials Engineering, Materials Science +16

Effects of Ultrasonic Power and Time on Bonding Strength and Interfacial Atomic Diffusion During Thermosonic Flip–Chip Bonding

Li Junhui, Liu Linggang, Luhua Deng et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +13

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