Jin Ho Kim

8 Gb 3-D DDR3 DRAM Using Through-Silicon-Via Technology

Uksong Kang, Hoeju Chung, Seongmoo Heo et al. · IEEE Journal of Solid-State Circuits · 2010 · 484 citations

3D Ic Architecture, Electrical Engineering, Engineering +12

Absolute Surface Density of the Amine Group of the Aminosilylated Thin Layers:  Ultraviolet−Visible Spectroscopy, Second Harmonic Generation, and Synchrotron-Radiation Photoelectron Spectroscopy Study

Joong Ho Moon, Jin Ho Kim, Ki-Jeong Kim et al. · Langmuir · 1997 · 157 citations

Engineering, Aminosilane Layer, Surface Nanotechnology +23

A Lightweight NEMO Protocol to Support 6LoWPAN

Jin Ho Kim · ETRI Journal · 2008 · 61 citations · Full text

Engineering, Computer Engineering, 6G +4

18.3 A 1.2V 64Gb 8-channel 256GB/s HBM DRAM with peripheral-base-die architecture and small-swing technique on heavy load interface

Jong Chern Lee, Jihwan Kim, Kyung Whan Kim et al. · 2016 · 40 citations

8-Channel 256Gb/s, Non-volatile Memory, Manycore Processor +15

Relaxation of the Si lattice strain in the Si(001)–SiO2 interface by annealing in N2O

Yong Ho Ha, Sun Young Lee, Jin Ho Kim et al. · Applied Physics Letters · 1999 · 22 citations

Materials Science, Materials Engineering, Engineering +10