Shigeru Imai

Evaluating the Large Electromigration Resistance of Copper Interconnects Employing a Newly Developed Accelerated Life‐Test Method

T. Nitta, Tadahiro Ohmi, T. Hoshi et al. · Journal of The Electrochemical Society · 1993 · 102 citations

Natural Sciences, Electrical Engineering, Materials Science +16

High-resolution shadow-mask patterning in deep holes and its application to an electrical wafer feed-through

G.J. Burger, Edwin Smulders, T.S.J. Lammerink et al. · Sensors and Actuators A Physical · 1996 · 60 citations · Full text

Engineering, Electrical Engineering, Manufacturing Engineering +11

Atomic layer epitaxy of Si using atomic H

Shigeru Imai, Toshio Iizuka, Osamu Sugiura et al. · Thin Solid Films · 1993 · 58 citations

Engineering, Materials Engineering, Materials Science +14

Study of aerodynamic characteristics in hard disk drives by numerical simulation

Hayato Shimizu, M. Tokuyama, Shigeru Imai et al. · IEEE Transactions on Magnetics · 2001 · 56 citations

Engineering, Computer Engineering, Physics +17

A Novel Atomic Layer Epitaxy Method of Silicon

Shigeru Imai, Satoru Takagi, Osamu Sugiura et al. · Japanese Journal of Applied Physics · 1991 · 43 citations

Natural Sciences, Materials Engineering, Materials Science +17