Kai‐Erik Elers - Concepedia

Author

Kai‐Erik Elers

ASM International

Also Known As

K.-E Elers, K.-E. Elers, K.‐E. Elers, Kai-Erik Elers, Kai‐Erik Elers

Publications

541

Citations

H-Index

Concepts

All Affiliations

ASM International University of Helsinki

About

Kai‐Erik Elers is an author at ASM International specializing in engineering, materials science, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	9	9	522
2	Applied Physics	8	8	459
3	Chemical Engineering	3	3	153
4	Chemistry	3	3	153
5	Electrical Engineering	1	1	28

Kai‐Erik Elers

Publications

522

Citations

H-Index

Page 1

	Year	Citations
Film Uniformity in Atomic Layer Deposition Kai‐Erik Elers, Tom Blomberg, M. Peussa, Chemical Vapor Deposition Materials ScienceSurface TechnologyEngineeringPhysicsTransition Metal Oxides	2006	124
Diffusion Barrier Deposition on a Copper Surface by Atomic Layer Deposition Kai‐Erik Elers, Ville Saanila, P. Soininen, Chemical Vapor Deposition EngineeringDiffusion Barrier MaterialsStep CoverageThin Film Process TechnologyChemical Deposition	2002	94
TiCl[sub 4] as a Precursor in the TiN Deposition by ALD and PEALD Kai‐Erik Elers, Jerry Winkler, K. Doran Weeks, Journal of The Electrochemical Society EngineeringTin Film DepositionChemistryChemical DepositionPlasma Processing	2005	77
Reduction of Copper Oxide Film to Elemental Copper P. Soininen, Kai‐Erik Elers, Ville Saanila, Journal of The Electrochemical Society Materials ScienceElectrometallurgyChemical EngineeringCopper Oxide MaterialsEngineering	2005	63
NbCl5 as a precursor in atomic layer epitaxy Kai‐Erik Elers, Mikko Ritala, Markku Leskelä, Applied Surface Science Materials ScienceEngineeringAtomic Layer EpitaxyApplied PhysicsAtomic Physics	1994	54
Atomic layer deposition of WxN/TiN and WNxCy/TiN nanolaminates Kai‐Erik Elers, Ville Saanila, W.-M. Li, Thin Solid Films Materials ScienceEngineeringNanotechnologySurface ScienceApplied Physics	2003	42
Physical and electrical characterization of ALCVD™ TiN and WNxCy used as a copper diffusion barrier in dual damascene backend structures (08.2) S. E. Smith, Weimin Li, Kai‐Erik Elers, Microelectronic Engineering Materials EngineeringMaterials ScienceElectrical EngineeringAluminium NitrideEngineering	2002	28
Enhancement of ALCVD™ TiN growth on Si–O–C and α-SiC:H films by O2-based plasma treatments A. Satta, Mikhaı̈l R. Baklanov, A. Vantomme, Microelectronic Engineering Materials EngineeringMaterials ScienceEngineeringSurface ScienceApplied Physics	2002	27
Silver Coated Platinum Core–Shell Nanostructures on Etched Si Nanowires: Atomic Layer Deposition (ALD) Processing and Application in SERS Katja Höflich, Michael Becker, Thomas Stelzner, ChemPhysChem Silver NitrateEngineeringMetal NanoparticlesNanostructured SurfaceSurface-enhanced Raman Scattering	2010	13

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