Kiyoshi Inamura

Neuromorphic vision chip fabricated using three-dimensional integration technology

Mitsumasa Koyanagi, Yasuo Nakagawa, Kangwook Lee et al. · 2002 · 113 citations

Engineering, Neuromorphic Vision Chip, Biomedical Engineering +20

New Three-Dimensional Integration Technology Based on Reconfigured Wafer-on-Wafer Bonding Technique

Takafumi Fukushima, Hirokazu Kikuchi, Yusuke Yamada et al. · 2007 · 94 citations

Engineering, Device Integration, Integration Technology +16

Intelligent image sensor chip with three dimensional structure

H. Kurino, K.W. Lee, T. Nakamura et al. · 2003 · 87 citations

Engineering, Device Integration, Integration Technology +21

Three-dimensional integration technology based on reconfigured wafer-to-wafer and multichip-to-wafer stacking using self-assembly method

Takafumi Fukushima, Eiji Iwata, Yuki Ohara et al. · 2009 · 56 citations

Engineering, Device Integration, Integrated Circuits +22

New heterogeneous multi-chip module integration technology using self-assembly method

Takafumi Fukushima, Toshihiro Konno, K. Kiyoyama et al. · 2008 · 54 citations

Self-assembly Method, Electrical Engineering, Engineering +15