Pablo Acosta-Alba

3D Sequential Integration: Application-driven technological achievements and guidelines

P. Batude, Laurent Brunet, C. Fenouillet-Béranger et al. · 2017 · 75 citations

Engineering, Computer Engineering, Electrical Engineering +15

Breakthroughs in 3D Sequential technology

Laurent Brunet, C. Fenouillet-Béranger, P. Batude et al. · 2018 · 52 citations

Engineering, Electrical Engineering, Materials Science +13

Pulsed laser annealing for advanced technology nodes: Modeling and calibration

Karim Huet, J. Aubin, Pierre-Edouard Raynal et al. · Applied Surface Science · 2019 · 51 citations

Engineering, Electrical Engineering, Microelectronics +11

Surface self-diffusion of silicon during high temperature annealing

Pablo Acosta-Alba, Oleg Kononchuk, Christophe Gourdel et al. · Journal of Applied Physics · 2014 · 35 citations · Full text

Natural Sciences, Materials Science, Physics +17

28nm FDSOI CMOS Technology (FEOL and BEOL) Thermal Stability for 3D Sequential Integration: Yield and Reliability Analysis

C. Cavalcante, C. Fenouillet-Béranger, P. Batude et al. · 2020 · 29 citations

Engineering, Computer Engineering, Electrical Engineering +17