Anil Kunwar

A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering

Anil Kunwar, Lili An, Jiahui Liu et al. · Journal of Material Science and Technology · 2020 · 52 citations · Full text

Materials Engineering, Materials Science, Engineering +9

Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints

Anil Kunwar, Shengyan Shang, Peter Råback et al. · Microelectronics Reliability · 2017 · 47 citations

Materials Engineering, Materials Science, Engineering +9

Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints

Bingfeng Guo, Anil Kunwar, Ning Zhao et al. · Materials Research Bulletin · 2017 · 40 citations

Materials Science, Materials Engineering, Engineering +9

Combining multi-phase field simulation with neural network analysis to unravel thermomigration accelerated growth behavior of Cu6Sn5 IMC at cold side Cu–Sn interface

Anil Kunwar, Johan Hektor, Sukeharu Nomoto et al. · International Journal of Mechanical Sciences · 2020 · 39 citations · Full text

Materials Science, Cu6sn5 Imc, Engineering +4

Synthesis of Cu@Ag core–shell nanoparticles for characterization of thermal stability and electric resistivity

Shengyan Shang, Anil Kunwar, Yanfeng Wang et al. · Applied Physics A · 2018 · 37 citations · Full text

Materials Science, Electric Resistivity, Engineering +6