Shengyan Shang

A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering

Anil Kunwar, Lili An, Jiahui Liu et al. · Journal of Material Science and Technology · 2020 · 52 citations · Full text

Materials Engineering, Materials Science, Engineering +9

Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints

Anil Kunwar, Shengyan Shang, Peter Råback et al. · Microelectronics Reliability · 2017 · 47 citations

Materials Engineering, Materials Science, Engineering +9

Synthesis of Cu@Ag core–shell nanoparticles for characterization of thermal stability and electric resistivity

Shengyan Shang, Anil Kunwar, Yanfeng Wang et al. · Applied Physics A · 2018 · 37 citations · Full text

Materials Science, Electric Resistivity, Engineering +6

Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling

Anil Kunwar, Bingfeng Guo, Shengyan Shang et al. · Intermetallics · 2017 · 22 citations

Materials Science, Materials Engineering, Heat Transfer Process +13

Enhancement of hardness of bulk solder by doping Cu nanoparticles at the interface of Sn/Cu solder joint

Shengyan Shang, Yanfeng Wang, Yunpeng Wang et al. · Microelectronic Engineering · 2019 · 20 citations · Full text

Materials Science, Materials Engineering, Engineering +7