In situ study on the increase of intermetallic compound thickness at anode of molten tin due to electromigration of copper

Current-induced marker motion in gold wires

H. B. Huntington, A. Gröne · Journal of Physics and Chemistry of Solids · 1961 · 836 citations

Engineering, Electrical Engineering, Physics +13

Kinetics of interfacial reaction in bimetallic CuSn thin films

K. N. Tu, R. D. Thompson · Acta Metallurgica · 1982 · 468 citations

Natural Sciences, Materials Engineering, Materials Science +14

FiPy: Partial Differential Equations with Python

Jonathan E. Guyer, Daniel Wheeler, James A. Warren · Computing in Science & Engineering · 2009 · 441 citations

Natural Sciences, Computer Science, Mathematics +14

Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples

H. Gan, K. N. Tu · Journal of Applied Physics · 2005 · 267 citations · Full text

Engineering, Materials Engineering, Materials Science +17

An introduction to Cu electromigration

Christine Hau-Riege · Microelectronics Reliability · 2004 · 222 citations

Natural Sciences, Materials Engineering, Materials Science +8