R. Van Hoof

Thermal modeling and management in ultrathin chip stack technology

S. Pinel, A. Marty, Josiane Tasselli et al. · IEEE Transactions on Components and Packaging Technologies · 2002 · 47 citations

Engineering, Energy Efficiency, Mechanical Engineering +18

Highly reliable CMOS-integrated 11MPixel SiGe-based micro-mirror arrays for high-end industrial applications

L. Haspeslagh, Jeroen De Coster, Olalla Varela Pedreira et al. · 2008 · 31 citations

Optical Materials, Engineering, Device Integration +26

CMOS-integrated poly-SiGe cantilevers with read/write system for probe storage device

S. Severi, J. Heck, T.-K. Chou et al. · TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference · 2009 · 21 citations

Engineering, Device Integration, Mechanical Engineering +18

Above-IC generic poly-SiGe thin film wafer level packaging and MEM device technology: Application to accelerometers

Baicang Guo, Lianggong Wen, Philippe Hélin et al. · 2011 · 19 citations

Engineering, Device Integration, Mem Device Technology +22

Highly reliable and extremely stable SiGe micro-mirrors

Maria Gromova, P. A. Muller, T. Lauwagie et al. · 2007 · 17 citations

Engineering, Micro-optical Component, Silicon On Insulator +16