A. H. Labun

Substrate bias effects in high-aspect-ratio SiO2 contact etching using an inductively coupled plasma reactor

A. C. Westerheim, A. H. Labun, J. H. Dubash et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1995 · 89 citations

Engineering, Electron-beam Lithography, Silicon On Insulator +17

Topography simulation for the virtual wafer fab

Timothy S. Cale, T. Merchant, L. Borucki et al. · Thin Solid Films · 2000 · 49 citations

Physical Design (Electronics), Wafer Scale Processing, Engineering +9

Rapid Method to Account for Process Variation in Full-Chip Capacitance Extraction

A. H. Labun · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 2004 · 40 citations

Engineering, Process Variation, Large Scale Integration +19

Etching of polysilicon in inductively coupled Cl2 and HBr discharges. I. Experimental characterization of polysilicon profiles

Arpan P. Mahorowala, Herbert H. Sawin, Richard D. Jones et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2002 · 31 citations

Engineering, Electron-beam Lithography, Glow Discharge +19

Nodular defect growth in thin films

M. J. Brett, R. Niall Tait, S. K. Dew et al. · Journal of Materials Science Materials in Electronics · 1992 · 20 citations

Materials Science, Engineering, Surface Science +5