Concepedia
Statistics
Publications
2
Citations
44
H-Index
Active since
2011
SeokHo Na is an author specializing in interconnect technology, materials science, and wire bonding.
Publications per year
2011–2022
Characterization of intermetallic compound (IMC) growth in Cu wire ball bonding on Al pad metallization
SeokHo Na, TaeKyeong Hwang, Jung Soo Park et al. · 2011 · 30 citations
Natural Sciences, Materials Engineering, Materials Science +17
Next Gen Laser Assisted Bonding (LAB) Technology
SeokHo Na, MinHo Gim, ChoongHoe Kim et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 14 citations
Engineering, Electrical Engineering, Materials Science +14
1–2 of 2