Statistics
Publications
3
Citations
71
H-Index
3
Active since
2016
MinHo Gim is an author specializing in flip-chip bonding, materials science, and chip packaging.
Publications per year
2016–2022
3
3
High-Performance Flip Chip Bonding Mechanism Study with Laser Assisted Bonding
MinHo Gim, ChoongHoe Kim, SeokHo Na et al. · 2020 · 16 citations
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