Statistics
Publications
2
Citations
30
H-Index
2
Active since
2017
SeokHo Na is an author specializing in wafer bonding, electronic materials, and chip packaging.
Publications per year
2017–2020
2
2
High-Performance Flip Chip Bonding Mechanism Study with Laser Assisted Bonding
MinHo Gim, ChoongHoe Kim, SeokHo Na et al. · 2020 · 16 citations
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