Statistics
Publications
3
Citations
44
H-Index
3
Active since
2017
ChoongHoe Kim is an author specializing in flip-chip packaging, electronic materials, and engineering.
Publications per year
2017–2022
3
3
High-Performance Flip Chip Bonding Mechanism Study with Laser Assisted Bonding
MinHo Gim, ChoongHoe Kim, SeokHo Na et al. · 2020 · 16 citations
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