TaeKyeong Hwang

Statistics

Publications

Citations

H-Index

Active since

2011

Affiliations

Amkor Technology (United States)(Current)

TaeKyeong Hwang is an author at Amkor Technology (United States) specializing in chip packaging, integrated circuit fabrication, and materials science.

Publications per year

2011–2020

Publications

Heterogeneous Integration Using Organic Interposer Technology

George Scott, JaeHun Bae, KiYeul Yang et al. · 2020 · 36 citations

Engineering, Computer Engineering, Computer Science +16

Characterization of intermetallic compound (IMC) growth in Cu wire ball bonding on Al pad metallization

SeokHo Na, TaeKyeong Hwang, Jung Soo Park et al. · 2011 · 30 citations

Natural Sciences, Materials Engineering, Materials Science +17

Wafer Level Multi-chip Gang Bonding Using TCNCF

Seokgeun Ahn, Hwankyu Kim, Dong Wook Kim et al. · 2016 · 23 citations

Engineering, Materials Engineering, Materials Science +16

1–3 of 3