Concepedia

Cyriaque P. Sukam

CP

Statistics

Publications

4

Citations

187

H-Index

4

Active since

2001

Affiliations

Rensselaer Polytechnic Institute(Current)

Cyriaque P. Sukam is an author at Rensselaer Polytechnic Institute specializing in engineering, mechanical engineering, and surface polishing.

Top concepts

EngineeringMechanical EngineeringMaterial ScienceSurface PolishingMaterial ProcessingMultiscale ModelingDesignFormal MethodsMicrostructureInverse Problems

Publications per year

2001–2004

4

Publications

4

Multiscale material removal modeling of chemical mechanical polishing

Jongwon Seok, Cyriaque P. Sukam, Andrew T. Kim et al. · Wear · 2003 · 88 citations

Materials Science, Engineering, Material Processing +7

Mathematical and Pragmatic Perspectives of Physical Programming

Achille Messac, Cyriaque P. Sukam, Emanuel Melachrinoudis · AIAA Journal · 2001 · 55 citations

Mathematical Programming, Engineering, Industrial Engineering +16

Material removal model for chemical–mechanical polishing considering wafer flexibility and edge effects

Jongwon Seok, Cyriaque P. Sukam, Andrew T. Kim et al. · Wear · 2004 · 31 citations

Materials Science, Materials Engineering, Engineering +8

Inverse analysis of material removal data using a multiscale CMP model

Jongwon Seok, Andrew T. Kim, Cyriaque P. Sukam et al. · Microelectronic Engineering · 2003 · 13 citations

Numerical Analysis, Engineering, Mechanical Engineering +9

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