Concepedia

Andrew T. Kim

AT

5

Publications

179

Citations

5

H-Index

2003

Active since

Affiliations

Rensselaer Polytechnic Institute(Current)

Andrew T. Kim is an author at Rensselaer Polytechnic Institute specializing in mechanical engineering, engineering, and materials science.

Top concepts

EngineeringMechanical EngineeringMaterial ScienceMultiscale ModelingRheologyMechanicsSoft MatterSurface PolishingMaterial ProcessingMechanics Of Materials

Publications per year

2003–2004

5

Publications

5

Multiscale material removal modeling of chemical mechanical polishing

Jongwon Seok, Cyriaque P. Sukam, Andrew T. Kim et al. · Wear · 2003 · 88 citations

Materials Science, Engineering, Material Processing +7

A Multiscale Elastohydrodynamic Contact Model for CMP

Andrew T. Kim, Jongwon Seok, John Tichy et al. · Journal of The Electrochemical Society · 2003 · 33 citations

Engineering, Multiscale Mechanics, Mechanical Engineering +20

Material removal model for chemical–mechanical polishing considering wafer flexibility and edge effects

Jongwon Seok, Cyriaque P. Sukam, Andrew T. Kim et al. · Wear · 2004 · 31 citations

Materials Science, Materials Engineering, Engineering +8

Soft Elastohydrodynamic Lubrication With Roughness

Andrew T. Kim, Jongwon Seok, John Tichy et al. · Journal of Tribology · 2003 · 14 citations

Tribological Coating, Global Elasticity, Engineering +17

Inverse analysis of material removal data using a multiscale CMP model

Jongwon Seok, Andrew T. Kim, Cyriaque P. Sukam et al. · Microelectronic Engineering · 2003 · 13 citations

Numerical Analysis, Engineering, Mechanical Engineering +9

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