Publication | Closed Access
Material removal model for chemical–mechanical polishing considering wafer flexibility and edge effects
31
Citations
35
References
2004
Year
Materials ScienceMaterials EngineeringEngineeringMaterial ProcessingMaterial MachiningMechanical EngineeringEdge EffectsWafer FlexibilitySurface PolishingSurface ProcessingMaterial Removal Model
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