Göran Wetter

Field-Experience Based Root-Cause Analysis of Power-Converter Failure in Wind Turbines

Katharina Fischer, Thomas Stalin, Hans Ramberg et al. · IEEE Transactions on Power Electronics · 2014 · 71 citations · Full text

Engineering, Electrical Engineering, Power Electronics +16

Thermal Cycling Aging Effect on the Shear Strength, Microstructure, Intermetallic Compounds (IMC) and Crack Initiation and Propagation of Reflow Soldered Sn-3.8Ag-0.7Cu and Wave Soldered Sn-3.5Ag Ceramic Chip Components

C. Andersson, Per‐Erik Tegehall, Dag Andersson et al. · IEEE Transactions on Components and Packaging Technologies · 2008 · 19 citations

Natural Sciences, Materials Engineering, Materials Science +17

Simulations of the impact of single-grained lead-free solder joints on the reliability of ball Grid Array components

Andreas Lövberg, Per‐Erik Tegehall, Göran Wetter et al. · 2017 · 14 citations

Natural Sciences, Materials Engineering, Materials Science +17

Impact of laminate cracks under solder pads on the fatigue lives of ball grid array solder joints

Per‐Erik Tegehall, Göran Wetter · Microelectronics Reliability · 2015 · 14 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +16

Thermal cycling of lead‐free Sn‐3.8Ag‐0.7Cu 388PBGA packages

C. Andersson, Bart Vandevelde, C. Noritake et al. · Soldering and Surface Mount Technology · 2009 · 13 citations

Natural Sciences, Materials Engineering, Materials Science +17