Jaydeep K. Sinha

Characterization of wafer geometry and overlay error on silicon wafers with nonuniform stress

Timothy A. Brunner, Vinayan C. Menon, Cheuk Wun Wong et al. · Journal of Micro/Nanolithography MEMS and MOEMS · 2013 · 47 citations · Full text

Engineering, Manufacturing Engineering, Manufacturing Processes +13

Characterization and mitigation of overlay error on silicon wafers with nonuniform stress

Timothy A. Brunner, Vinayan C. Menon, Cheuk Wun Wong et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2014 · 20 citations

Engineering, Materials Science, Computer-integrated Manufacturing +15

Infrared interferometry for rough surface measurements: application to failure characterization and flaw detection

Jaydeep K. Sinha · Optical Engineering · 1997 · 19 citations

Engineering, Materials Engineering, Materials Science +17

Impact of Wafer Geometry on CMP for Advanced Nodes

Pradeep Vukkadala, Kevin T. Turner, Jaydeep K. Sinha · Journal of The Electrochemical Society · 2011 · 19 citations

Engineering, Materials Engineering, Materials Science +17

An interferometric and finite element investigation of interfacial crack tip fields: Role of mode-mixity on 3-D stress variations

Jaydeep K. Sinha, Hareesh V. Tippur, Liming Xu · International Journal of Solids and Structures · 1997 · 17 citations

Engineering, Materials Engineering, Materials Science +15