Sibum Kim

Interconnect Fabrication by Superconformal Iodine-Catalyzed Chemical Vapor Deposition of Copper

D. Josell, Sibum Kim, Daniel Wheeler et al. · Journal of The Electrochemical Society · 2003 · 35 citations

Materials Science, Materials Engineering, Chemical Engineering +15

Seam-free fabrication of submicrometer copper interconnects by iodine-catalyzed chemical vapor deposition

Sung Gyu Pyo, Sibum Kim, Daniel Wheeler et al. · Journal of Applied Physics · 2003 · 18 citations

Engineering, Chemistry, Chemical Deposition +22

Effects of Fluorine on the NBTI Reliability and Low-Frequency Noise Characteristics of p-MOSFETs

Sung-Kyu Kwon, Hyuk-Min Kwon, In‐Shik Han et al. · IEEE Journal of the Electron Devices Society · 2018 · 18 citations · Full text

Engineering, Fluorine Implantation Energy, Flicker Noise +16

Characterizing Voltage Linearity and Leakage Current of High Density <formula formulatype="inline"><tex Notation="TeX">$\hbox{Al}_{2}\hbox{O}_{3}/\hbox{HfO}_{2}/\hbox{Al}_{2}\hbox{O}_{3}$</tex> </formula> MIM Capacitors

Sung Kyun Lee, Kwan Soo Kim, Soon-Wook Kim et al. · IEEE Electron Device Letters · 2011 · 15 citations

Materials Engineering, Materials Science, Electrical Engineering +12

Effects of electrical stress on the leakage current characteristics of multilayer capacitor structures

Soon-Wook Kim, Sung Kyun Lee, Young Do Kim et al. · Applied Physics Letters · 2010 · 11 citations

Dielectrics, Engineering, Leakage Current Characteristics +16