Concepedia
Statistics
Publications
3
Citations
75
H-Index
Active since
2000
Affiliations
Motorola (United States)(Current)
Fraunhofer Institute for Reliability and Microintegration
K. Kaskoun is an author at Motorola (United States) specializing in chip packaging, engineering, and semiconductor devices.
Publications per year
2000–2002
Fab Integrated Packaging (FIP): a new concept for high reliability wafer-level chip size packaging
Michael J. Topper, J. Auersperg, V. Glaw et al. · 2000 · 40 citations
Engineering, Manufacturing Engineering, Microfabrication +14
Experimental and numerical reliability investigations of FCOB assemblies with process-induced defects
Andreas Schubert, R. Dudek, J. Kloeser et al. · 2000 · 24 citations
Engineering, Materials Engineering, Materials Science +17
Physical design and assembly process development of a multi-chip package containing a light emitting diode (LED) array die
R. Bonda, Ting Fang, K. Kaskoun et al. · 2002 · 11 citations
Engineering, Electrical Engineering, Materials Engineering +17
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