Shreya Dwarakanath

Glass Panel Packaging, as the Most Leading-Edge Packaging: Technologies and Applications

Rao Tummala, Bartlet DeProspo, Shreya Dwarakanath et al. · 2020 · 28 citations

Engineering, Computer Architecture, Transistor Performance +19

Advances in High Performance RDL Technologies for Enabling IO Density of 500 IOs/mm/layer and 8-μm IO Pitch Using Low-k Dielectrics

Fuhan Liu, Rui Zhang, Bartlet DeProspo et al. · 2020 · 21 citations

Engineering, Device Integration, Io Density +20

Evaluation of Fine-Pitch Routing Capabilities of Advanced Dielectric Materials for High Speed Panel-RDL in 2.5D Interposer and Fan-Out Packages

Shreya Dwarakanath, P. Markondeya Raj, Amit Agarwal et al. · 2019 · 17 citations

Engineering, Vlsi Design, Mechanical Engineering +17

Next Generation Panel-Scale RDL with Ultra Small Photo Vias and Ultra-Fine Embedded Trenches for Low Cost 2.5D Interposers and High Density Fan-Out WLPs

Fuhan Liu, Atsushi Kubo, Chandrasekharan Nair et al. · 2016 · 13 citations

Engineering, Line Width, Integrated Circuits +20

Vapor phase infiltration of aluminum oxide into benzocyclobutene-based polymer dielectrics to increase adhesion strength to thin film metal interconnects

Shreya Dwarakanath, P. Markondeya Raj, Neha Kondekar et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2020 · 10 citations