Concepedia

Bartlet DeProspo

BD

10

Publications

196

Citations

10

H-Index

2018

Active since

Affiliations

Georgia Institute of Technology(Current)

Bartlet DeProspo is an author at Georgia Institute of Technology specializing in engineering, electronic packaging, and advanced packaging.

Top concepts

EngineeringElectronic PackagingAdvanced PackagingApplied PhysicsMaterial ScienceMicroelectronicsMicrofabricationIntegrated CircuitsOptoelectronic DevicesPhotonics

Publications per year

2018–2020

10

Publications

10

Heterogeneous integration for artificial intelligence: Challenges and opportunities

Saibal Mukhopadhyay, Yin Long, Burhan Ahmad Mudassar et al. · IBM Journal of Research and Development · 2019 · 37 citations

Artificial Intelligence, Hardware Security, Engineering +15

Glass Panel Packaging, as the Most Leading-Edge Packaging: Technologies and Applications

Rao Tummala, Bartlet DeProspo, Shreya Dwarakanath et al. · 2020 · 28 citations

Engineering, Computer Architecture, Transistor Performance +19

Innovative Sub-5-$\mu$ m Microvias by Picosecond UV Laser for Post-Moore Packaging Interconnects

Fuhan Liu, Gaurav Khurana, Rui Zhang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2019 · 21 citations

Optical Materials, Engineering, First Time Microvias +26

Advances in High Performance RDL Technologies for Enabling IO Density of 500 IOs/mm/layer and 8-μm IO Pitch Using Low-k Dielectrics

Fuhan Liu, Rui Zhang, Bartlet DeProspo et al. · 2020 · 21 citations

Engineering, Device Integration, Io Density +20

Heterogeneous and homogeneous package integration technologies at device and system levels

Rao Tummala, Nithin Nedumthakady, Siddharth Ravichandran et al. · 2018 · 20 citations

Engineering, Device Integration, Hardware-software Integration +26

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