Concepedia

Fengman Liu

FL

15

Publications

400

Citations

11

H-Index

2011

Active since

Affiliations

Institute of Microelectronics(Current)

Chinese Academy of Sciences

National Center for Advanced Packaging (China)

Institute of Semiconductors

Delft University of Technology

Fengman Liu is an author at Institute of Microelectronics specializing in engineering, electrical engineering, and photonics.

Top concepts

EngineeringElectrical EngineeringPhotonicsOptoelectronicsMicroelectronicsIntegrated CircuitsHeat TransferApplied PhysicsOptical SystemsMaterial Science

Publications per year

2011–2023

15

Publications

15

Co-packaged optics (CPO): status, challenges, and solutions

Min Tan, Jiang Xu, Siyang Liu et al. · Frontiers of Optoelectronics · 2023 · 108 citations · Full text

Optical Materials, Engineering, Device Integration +22

Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package

Fengze Hou, Tingyu Lin, Liqiang Cao et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 73 citations

Microchannel Thermal Management System With Two-Phase Flow for Power Electronics Over 500 W/cm<sup>2</sup> Heat Dissipation

Fengze Hou, Hengyun Zhang, Dezhu Huang et al. · IEEE Transactions on Power Electronics · 2020 · 39 citations · Full text

Engineering, Energy Efficiency, Power Electronic Systems +16

Design of a PAM-4 VCSEL-Based Transceiver Front-End for Beyond-400G Short-Reach Optical Interconnects

Jian He, Donglai Lu, Haiyun Xue et al. · IEEE Transactions on Circuits and Systems I Regular Papers · 2022 · 29 citations

Optical Transmitter, Optical Materials, Engineering +18

Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate

Cheng Chen, Fengze Hou, Fengman Liu et al. · Microelectronics Reliability · 2017 · 23 citations

Electrical Engineering, Engineering, Thermo-mechanical Reliability Analysis +7

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