Concepedia

C. Zhang

CZ

Statistics

Publications

4

Citations

433

H-Index

4

Active since

2001

Affiliations

Motorola (United States)(Current)

C. Zhang is an author at Motorola (United States) specializing in electronic materials, materials engineering, and chip packaging.

Publications per year

2001–2002

4

Publications

4

Pb-free solders for flip-chip interconnects

D. R. Frear, Jihun Jang, J. K. Lin et al. · JOM · 2001 · 317 citations

, , +14

Characterization of lead-free solders and under bump metallurgies for flip-chip package

Jong‐Kai Lin, A. De Silva, D. R. Frear et al. · 2002 · 55 citations

, , +17

Characterization of lead-free solders and under bump metallurgies for flip-chip package

Jong‐Kai Lin, A. De Silva, D. R. Frear et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2002 · 39 citations

, , +17

Thermal fatigue properties of lead-free solders on Cu and NiP under bump metallurgies

C. Zhang, Jong‐Kai Lin, Li Li · 2002 · 22 citations

, , +17

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