Marc Dreissigacker

Statistics

Publications

Citations

101

H-Index

Active since

2018

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

Infineon Technologies (Germany)

Marc Dreissigacker is an author at Fraunhofer Institute for Reliability and Microintegration specializing in fan-out wafer-level packaging, engineering, and packaging engineering.

Publications per year

2018–2020

Publications

Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration

Tanja Braun, Karl‐Friedrich Becker, Ole Hoelck et al. · Micromachines · 2019 · 51 citations · Full text

Engineering, Manufacturing Engineering, Energy Systems +14

Fan-Out Wafer Level Packaging - A Platform for Advanced Sensor Packaging

Tanja Braun, Karl‐Friedrich Becker, Ole Hoelck et al. · 2019 · 22 citations

Engineering, Biomedical Engineering, Materials Science +17

On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers

Ali Roshanghias, Marc Dreissigacker, Christina Scherf et al. · Micromachines · 2020 · 17 citations · Full text

Engineering, Manufacturing Engineering, Mechanical Engineering +17

The Realization of Redistribution Layers for FOWLP by Inkjet Printing

Ali Roshanghias, Ying Ma, Marc Dreissigacker et al. · 2018 · 11 citations · Full text

Engineering, Manufacturing Engineering, Materials Engineering +10

1–4 of 4