Concepedia

Author

Ali Roshanghias

Carinthian Tech ResearchORCID

Also Known As

A Roshanghias, A. Roshan-Ghias, A. Roshanghias, Ali Roshanghias, Jairo Ramrez-Sarabia

90

Publications

1.1K

Citations

21

H-Index

60

Concepts

All Affiliations

Carinthian Tech ResearchSilicon Austria Labs (Austria)University of ViennaSharif University of TechnologyUniversity of Klagenfurt
AR

About

Ali Roshanghias is an author at Carinthian Tech Research specializing in engineering, materials science, and electronic packaging.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

18

26

746

2

Applied Physics

8

8

213

3

Chemical Engineering

4

4

124

4

Biomedical Engineering

2

2

94

5

Chemistry

2

2

41

Ali Roshanghias

×

34

Publications

902

Citations

21

H-Index

YearCitations

Impedance analysis for condition monitoring of single lap CNT-epoxy adhesive joint

Omid Sam-Daliri, Lisa-Marie Faller, Mohammadreza Farahani,

International Journal of Adhesion and Adhesives

2018

55

Sintering strategies for inkjet printed metallic traces in 3D printed electronics

Ali Roshanghias, Matic Krivec, Marcus Baumgart

Flexible and Printed Electronics

2017

54

Printed Electronics Technologies for Additive Manufacturing of Hybrid Electronic Sensor Systems

Johanna Zikulnig, Sean Chang, Jo Bito,

Advanced Sensor Research

2023

51

Inkjet printing and characterisation of a resistive temperature sensor on paper substrate

Johanna Zikulnig, Christina Hirschl, Lukas Rauter,

Flexible and Printed Electronics

2019

49

Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

A. Yakymovych, Yu. Plevachuk, P. Švec,

Journal of Electronic Materials

2016

47

Estimation of modal parameters using bilinear joint time–frequency distributions

Ali Roshanghias, Mohammad Bagher Shamsollahi, Mohammad Mobed,

Mechanical Systems and Signal Processing

2006

42

Flip Chip integration of ultra-thinned dies in low-cost flexible printed electronics; the effects of die thickness, encapsulation and conductive adhesives

Muhammad Hassan Malik, Giovanna Grosso, Hubert Zangl,

Microelectronics Reliability

2021

39

Exploiting the combination of 3D polymer printing and inkjet Ag-nanoparticle printing for advanced packaging

Matic Krivec, Ali Roshanghias, Anže Abram,

Microelectronic Engineering

2016

36

Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles

A. Yakymovych, Yu. Plevachuk, P. Švec,

Journal of Materials Science Materials in Electronics

2017

35

Sn–Ag–Cu nanosolders: Melting behavior and phase diagram prediction in the Sn-rich corner of the ternary system

Ali Roshanghias, Jan Vřešťál, A. Yakymovych,

Calphad

2015

32

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