Nengyuan Zeng

Improvement in chemical mechanical polishing of 4H-SiC wafer by activating persulfate through the synergistic effect of UV and TiO2

Wantang Wang, Baoguo Zhang, Yunhui Shi et al. · Journal of Materials Processing Technology · 2021 · 103 citations

Materials Science, Materials Engineering, Chemical Engineering +11

Improved chemical mechanical polishing performance in 4H-SiC substrate by combining novel mixed abrasive slurry and photocatalytic effect

Wantang Wang, Baoguo Zhang, Yunhui Shi et al. · Applied Surface Science · 2021 · 92 citations

Materials Science, Materials Engineering, Chemical Engineering +12

Corrosion control of copper wiring by barrier CMP slurry containing azole inhibitor: Combination of simulation and experiment

Tengda Ma, Baimei Tan, Yi Xu et al. · Colloids and Surfaces A Physicochemical and Engineering Aspects · 2020 · 86 citations

Materials Science, Chemical Engineering, Copper Wiring +7

Comparison of anionic surfactants dodecylbenzene sulfonic acid and 1,2,4-triazole for inhibition of Co corrosion and study of the mechanism for passivation of the Co surface by dodecylbenzene sulfonic acid

Yuanshen Cheng, Chenwei Wang, Shengli Wang et al. · Journal of Molecular Liquids · 2022 · 41 citations

Chemical Engineering, Corrosion Protection, Engineering +10

Multidimensional insights into the corrosion inhibition of potassium oleate on Cu in alkaline medium: A combined Experimental and theoretical investigation

Tengda Ma, Baimei Tan, Lei Guo et al. · Materials Science and Engineering B · 2021 · 34 citations

Materials Science, Chemical Engineering, Corrosion Protection +8