Tengda Ma

Improvement in chemical mechanical polishing of 4H-SiC wafer by activating persulfate through the synergistic effect of UV and TiO2

Wantang Wang, Baoguo Zhang, Yunhui Shi et al. · Journal of Materials Processing Technology · 2021 · 112 citations

Engineering, Materials Engineering, Materials Science +14

Corrosion control of copper wiring by barrier CMP slurry containing azole inhibitor: Combination of simulation and experiment

Tengda Ma, Baimei Tan, Yi Xu et al. · Colloids and Surfaces A Physicochemical and Engineering Aspects · 2020 · 87 citations

Natural Sciences, Electrical Engineering, Materials Science +17

Preparation of poly (vinyl alcohol)/polydopamine/tannin acid composite hydrogels with dual adhesive, antioxidant and antibacterial properties

Guanghua He, Yaqian Zhou, Xiuhao Chen et al. · European Polymer Journal · 2023 · 49 citations

Natural Sciences, Materials Engineering, Materials Science +17

The effect of structural properties of benzo derivative on the inhibition performance for copper corrosion in alkaline medium: Experimental and theoretical investigations

Wei Li, Tengda Ma, Baimei Tan et al. · Colloids and Surfaces A Physicochemical and Engineering Aspects · 2022 · 48 citations

Natural Sciences, Chemistry, Materials Science +17

Synergistic effect of composite complex agent on BTA removal in post CMP cleaning of copper interconnection

Da Yin, Yang Liu, Tengda Ma et al. · Materials Chemistry and Physics · 2020 · 47 citations

Engineering, Materials Engineering, Materials Science +16