Stephan Guttowski

High-Frequency Modeling of TSVs for 3-D Chip Integration and Silicon Interposers Considering Skin-Effect, Dielectric Quasi-TEM and Slow-Wave Modes

Ivan Ndip, Brian Curran, Kai Löbbicke et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 151 citations

Engineering, Electrical Engineering, Microelectronics +16

Efficient HF Modeling and Model Parameterization of Induction Machines for Time and Frequency Domain Simulations

M. Schinkel, S. Weber, Stephan Guttowski et al. · 2006 · 114 citations

Engineering, Electrical Engineering, Circuit Theory +12

Analytical, Numerical-, and Measurement–Based Methods for Extracting the Electrical Parameters of Through Silicon Vias (TSVs)

Ivan Ndip, Kai Zoschke, Kai Löbbicke et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 84 citations

Engineering, Electrical Engineering, Microelectronics +16

EMC issues in cars with electric drives

Stephan Guttowski, S. Weber, Eckart Hoene et al. · 2003 · 83 citations

Engineering, Automotive Engineering, Electrical Engineering +17

Design and evaluation of Feedforward Active ripple filters

Mingjuan Zhu, David J. Perreault, V. Caliskan et al. · IEEE Transactions on Power Electronics · 2005 · 47 citations · Full text

Engineering, Electrical Engineering, Analog Electronics +16