Yasuhiko Chinzei

SiO₂ Etching Employing Inductively Coupled Plasma with Hot Inner Wall

Yasuhiko Chinzei, Takanori Ichiki, Ryo Kurosaki et al. · Japanese Journal of Applied Physics · 1996 · 29 citations

Engineering, Materials Engineering, Materials Science +17

High aspect ratio SiO2 etching with high resist selectivity improved by addition of organosilane to tetrafluoroethyl trifluoromethyl ether

Yasuhiko Chinzei, Yannick Feurprier, M. Ozawa et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2000 · 23 citations

Natural Sciences, Materials Engineering, Materials Science +15

Residence time effects on SiO2/Si selective etching employing high density fluorocarbon plasma

Yasuhiko Chinzei, Takanori Ichiki, Naokatsu Ikegami et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1998 · 21 citations

Natural Sciences, Materials Engineering, Materials Science +17

Microloading effect in ultrafine SiO2 hole/trench etching

Yannick Feurprier, Yasuhiko Chinzei, Makoto Ogata et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1999 · 12 citations

Engineering, Materials Engineering, Materials Science +13

Flow rate rule for high aspect ratio SiO2 hole etching

Yasuhiko Chinzei, Makoto Ogata, Haruo Shindo et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1998 · 12 citations

Engineering, Materials Engineering, Materials Science +17