Derick Jones

Foveros: 3D Integration and the use of Face-to-Face Chip Stacking for Logic Devices

D. Ingerly, Sally Safwat Amin, L. Aryasomayajula et al. · 2019 · 154 citations

Engineering, Computer Engineering, Embedded Systems +16

Low-k interconnect stack with metal-insulator-metal capacitors for 22nm high volume manufacturing

D. Ingerly, Ankur Agrawal, Ricardo Ascázubi et al. · 2012 · 49 citations

Engineering, Materials Engineering, Materials Science +13

A 65nm ultra low power logic platform technology using uni-axial strained silicon transistors

C.-H. Jan, Jaeseok Choi, G. Curello et al. · 2006 · 43 citations

Engineering, Computer Engineering, Electrical Engineering +17

DYNAMIC SCATTERING IN A ROOM-TEMPERATURE NEMATIC LIQUID CRYSTAL

Derick Jones, Linda T. Creagh, Sun Lu · Applied Physics Letters · 1970 · 29 citations

Natural Sciences, Materials Science, Physics +14

ELECTRICAL FIELD DISTRIBUTION ASSOCIATED WITH DYNAMIC SCATTERING IN NEMATIC LIQUID CRYSTALS

Sun Lu, Derick Jones · Applied Physics Letters · 1970 · 24 citations

Natural Sciences, Materials Science, Crystal Structure +12