Huixiong Dai - Concepedia

Author

Huixiong Dai

Applied Materials (United States)

Also Known As

H. Dai, Haohao Dai, Huixiong Dai, Hunh-Ru Dai, Hunh‐Ru Dai

Publications

620

Citations

H-Index

Concepts

All Affiliations

Applied Materials (United States)Cadence Design Systems (United States)Stanford University GlobalFoundries (United States)

About

Huixiong Dai is an author at Applied Materials (United States) specializing in engineering, microelectronics, and computer engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	11	12	559
2	Computer Engineering	9	9	365
3	Applied Physics	6	6	416
4	Social Sciences	3	3	103
5	Natural Sciences	1	1	11

Huixiong Dai

Publications

559

Citations

H-Index

Page 1

	Year	Citations
22nm half-pitch patterning by CVD spacer self alignment double patterning (SADP) Chris Bencher, Yong Mei Chen, Huixiong Dai, Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE Physical Design (Electronics)Wafer Scale ProcessingEngineeringElectron-beam LithographyBeam Lithography	2008	128
Flexible Control of Block Copolymer Directed Self‐Assembly using Small, Topographical Templates: Potential Lithography Solution for Integrated Circuit Contact Hole Patterning He Yi, Xinyu Bao, Jie Zhang, Advanced Materials EngineeringMechanical EngineeringIntegrated CircuitsContact Hole PatterningBlock Copolymer	2012	117
Directed self-assembly defectivity assessment. Part II Chris Bencher, He Yi, Jessica Zhou, Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE EngineeringMechanical EngineeringDefect ToleranceSocial SciencesSelf-assembly Defectivity Assessment	2012	67
Gridded design rule scaling: taking the CPU toward the 16nm node Christopher Bencher, Huixiong Dai, Yong Mei Chen Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE Cluster ComputingEngineeringVlsi DesignComputer ArchitectureIntegrated Circuits	2009	51
SRAM, NAND, DRAM contact hole patterning using block copolymer directed self-assembly guided by small topographical templates Xinyu Bao, He Yi, Christopher Bencher, EngineeringElectron-beam LithographyPattern TransferOptoelectronic DevicesIntegrated Circuits	2011	43
Decomposition strategies for self-aligned double patterning Yuansheng Ma, Jason Sweis, Chris Bencher, Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE Mathematical ProgrammingEngineeringVlsi DesignElectronic Design AutomationComputer Architecture	2010	41
APF pitch-halving for 22nm logic cells using gridded design rules Michael C. Smayling, Christopher Bencher, Hao D. Chen, Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE Electrical EngineeringPhysical Design (Electronics)EngineeringVlsi DesignCircuit Design	2008	30
Through-silicon-via technology for 3D integration John Dukovic, S. Ramaswami, Sharma Pamarthy, 3D Ic ArchitectureElectrical EngineeringIc IndustryEngineeringThrough-silicon-via Technology	2010	25
Mandrel-based patterning: density multiplication techniques for 15nm nodes Chris Bencher, Huixiong Dai, Liyan Miao, Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE EngineeringAdvanced ComputingPattern TransferDensity Multiplication TechniquesComputer-aided Design	2011	20
Double patterning compliant logic design Yuangsheng Ma, Jason Sweis, Chris Bencher, Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE Applied LogicEngineeringVlsi DesignElectronic Design AutomationCompliant Logic Design	2011	16

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