Shinji Sugatani

Review of Bumpless Build Cube (BBCube) Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI)

Takayuki Ohba, Koji Sakui, Shinji Sugatani et al. · Electronics · 2022 · 22 citations · Full text

Engineering, Device Integration, Computer Architecture +22

CP element based design for 14nm node EBDW high volume manufacturing

Takashi Maruyama, Yasuhide Machida, Shinji Sugatani et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2012 · 19 citations

Engineering, Vlsi Design, Electron-beam Lithography +22

EBDW technology for EB shuttle at 65nm node and beyond

Takashi Maruyama, Masaki Takakuwa, Yoshikatsu Kojima et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2008 · 18 citations

Industrial Design, Electrical Engineering, Physical Design (Electronics) +13

A high-speed NDRO analog memory using electrodeposited permalloy wires

S. Konishi, Shinji Sugatani, Yasushi Sakurai · IEEE Transactions on Magnetics · 1969 · 13 citations

Engineering, Analog Design, Computer Architecture +16

Bumpless Build Cube (BBCube): High-Parallelism, High-Heat-Dissipation and Low-Power Stacked Memory using Wafer-Level 3D Integration Process

Norio Chujo, Koji Sakui, Hiroyuki Ryoson et al. · 2020 · 13 citations

Engineering, Computer Architecture, Integrated Circuits +21