Concepedia

Hiroyuki Ryoson

HR

6

Publications

149

Citations

6

H-Index

1993

Active since

Affiliations

Tokyo Institute of Technology(Current)

Hiroyuki Ryoson is an author at Tokyo Institute of Technology specializing in engineering, electrical engineering, and microelectronics.

Top concepts

EngineeringMicroelectronicsElectrical EngineeringComputer EngineeringComputer Architecture3D Printing3D IntegrationMicrofabricationParallel ComputingIntegrated Circuits

Publications per year

1993–2022

6

Publications

6

Tensile and fatigue fracture behavior and water-environment effects in a SiC-whisker/7075-aluminum composite

K. Komai, K. Minoshima, Hiroyuki Ryoson · Composites Science and Technology · 1993 · 67 citations

Materials Science, Engineering, Fatigue Fracture Behavior +8

Review of Bumpless Build Cube (BBCube) Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI)

Takayuki Ohba, Koji Sakui, Shinji Sugatani et al. · Electronics · 2022 · 22 citations · Full text

Engineering, Device Integration, Computer Architecture +22

On-Chip CMOS-MEMS-Based Electroosmotic Flow Micropump Integrated With High-Voltage Generator

Yuki Okamoto, Hiroyuki Ryoson, Koji Fujimoto et al. · Journal of Microelectromechanical Systems · 2019 · 18 citations · Full text

Electrical Engineering, Electrohydrodynamics, Engineering +12

Nano-Structured Two-Phase Heat Spreader for Cooling Ultra-High Heat Flux Sources

Mitsuo Hashimoto, Hiroto Kasai, Kazuma Usami et al. · 2010 14th International Heat Transfer Conference, Volume 3 · 2010 · 17 citations

Heat Transfer Process, Engineering, Liquid Metal Cooling +13

Bumpless Build Cube (BBCube): High-Parallelism, High-Heat-Dissipation and Low-Power Stacked Memory using Wafer-Level 3D Integration Process

Norio Chujo, Koji Sakui, Hiroyuki Ryoson et al. · 2020 · 13 citations

Engineering, Computer Architecture, Integrated Circuits +21

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