Benjamin Leyrer

Copper Die-Bonding Sinter Paste: Sintering and Bonding Properties

Dai Ishikawa, Hideo Nakako, Yuki Kawana et al. · 2018 7th Electronic System-Integration Technology Conference (ESTC) · 2018 · 26 citations

Engineering, Bonding Properties, Cu Sinter Paste +17

Bonding Strength of Cu Sinter Die-Bonding Paste on Ni, Cu, Ag, and Au Surfaces under Pressureless Bonding Process

Dai Ishikawa, Bao Ngoc An, Matthias Mail et al. · Transactions of The Japan Institute of Electronics Packaging · 2020 · 25 citations · Full text

Engineering, Mechanical Engineering, Molecular Dynamics +18

Copper thick-film substrates for power electronic applications

Thomas Blank, Benjamin Leyrer, Tobias Maurer et al. · 2014 · 18 citations

Materials Science, Advanced Packaging, Electrical Engineering +13

Highly integrated power modules based on copper thick-film-on-DCB for high frequency operation of SiC semiconductors — Design and manufacture

Max Schmenger, Dean Hamilton, Benjamin Leyrer et al. · 2015 · 15 citations · Full text

Engineering, Power Electronic Systems, Power Electronics +17

High power density LED modules with silver sintering die attach on aluminum nitride substrates

Marc Schneider, Benjamin Leyrer, Christian Herbold et al. · 2014 · 10 citations