Hideo Nakako

Novel materials for electronic device fabrication using ink-jet printing technology

Yasushi Kumashiro, Hideo Nakako, Maki Inada et al. · Applied Surface Science · 2009 · 28 citations

Materials Science, Electronic Devices, Engineering +10

Copper Die-Bonding Sinter Paste: Sintering and Bonding Properties

Dai Ishikawa, Hideo Nakako, Yuki Kawana et al. · 2018 7th Electronic System-Integration Technology Conference (ESTC) · 2018 · 26 citations

Engineering, Bonding Properties, Cu Sinter Paste +17

Bonding Strength of Cu Sinter Die-Bonding Paste on Ni, Cu, Ag, and Au Surfaces under Pressureless Bonding Process

Dai Ishikawa, Bao Ngoc An, Matthias Mail et al. · Transactions of The Japan Institute of Electronics Packaging · 2020 · 25 citations · Full text

Engineering, Mechanical Engineering, Molecular Dynamics +18

Effect of Manufacturing Process on Micro-Deformation Behavior of Sintered-Silver Die-Attach Material

Tomohisa Suzuki, Takeshi Terasaki, Yuki Kawana et al. · IEEE Transactions on Device and Materials Reliability · 2016 · 22 citations

Thermal cycling lifetime estimation of sintered metal die attachment

Tomohisa Suzuki, Y. Yasuda, Takeshi Terasaki et al. · 2016 · 19 citations

Engineering, Life Prediction, Thermal Analysis +16