Takeshi Terasaki - Concepedia

Author

Takeshi Terasaki

Tohoku University

Also Known As

TAKESHI TERASAKI, Takeshi TERASAKI, Takeshi Terasaki

Publications

399

Citations

H-Index

Concepts

All Affiliations

Tohoku University Hitachi (Japan)

About

Takeshi Terasaki is an author at Tohoku University specializing in engineering, applied physics, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	8	8	200
2	Applied Physics	7	7	228
3	Electrical Engineering	3	3	109
4	Civil Engineering	1	1	14
5	Engineering Physics	1	1	14

Takeshi Terasaki

Publications

318

Citations

H-Index

Page 1

	Year	Citations
Epitaxial Growth with Light Irradiation Masashi Kumagawa, Hideo Sunami, Takeshi Terasaki, Japanese Journal of Applied Physics Materials EngineeringMaterials ScienceElectrical EngineeringEpitaxial GrowthEngineering	1968	74
Silicon epitaxial growth Jun‐ichi Nishizawa, Takeshi Terasaki, M. Shimbo Journal of Crystal Growth PhysicsApplied PhysicsSilicon Epitaxial GrowthSemiconductor Device FabricationSilicon On Insulator	1972	49
Layer growth in silicon epitaxy Jun‐ichi Nishizawa, Takeshi Terasaki, M. Shimbo Journal of Crystal Growth PhysicsApplied PhysicsLayer GrowthMolecular Beam EpitaxySilicon On Insulator	1972	35
Perfect Crystal Growth of Silicon by Vapor Deposition Jun‐ichi Nishizawa, Takeshi Terasaki, Kunihiko Yagi, Journal of The Electrochemical Society Materials ScienceSemiconductorsPerfect Crystal GrowthCompensation EffectSimultaneous Doping	1975	25
Correlation Between Whisker Initiation and Compressive Stress in Electrodeposited Tin–Copper Coating on Copper Leadframes Takahiko Kato, Haruo Akahoshi, Masato Nakamura, IEEE Transactions on Electronics Packaging Manufacturing Compressive StressEngineeringMechanical EngineeringCopper LeadframesCorrosion	2010	23
Effect of Manufacturing Process on Micro-Deformation Behavior of Sintered-Silver Die-Attach Material Tomohisa Suzuki, Takeshi Terasaki, Yuki Kawana, IEEE Transactions on Device and Materials Reliability	2016	22
Thermal cycling lifetime estimation of sintered metal die attachment Tomohisa Suzuki, Y. Yasuda, Takeshi Terasaki, EngineeringLife PredictionThermal AnalysisThermodynamicsElectronic Packaging	2016	19
Macro- and Micro-Deformation Behavior of Sintered-Copper Die-Attach Material Tomohisa Suzuki, Y. Yasuda, Takeshi Terasaki, IEEE Transactions on Device and Materials Reliability Materials ScienceSinteringPowder MetallurgyEngineeringMacro-deformation Properties	2017	19
A New Method for Evaluating Fatigue Life of Micro-Solder Joints in Semiconductor Structures Hisashi Tanie, Takeshi Terasaki, Yasuhiro NAKA EngineeringMechanical EngineeringMicro-solder JointsDynamic Crack PropagationFracture Modeling	2005	16
Surface Orientation Effect of the Shadow of the Stacking Fault Hideo Sunami, Takeshi Terasaki, Nobuo Miyamoto, Journal of Applied Physics J. ApplEngineeringSurface Orientation EffectBibliometricsGeophysics	1969	14

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