Concepedia

Bao Ngoc An

BN

Statistics

Publications

2

Citations

51

H-Index

2

Active since

2018

Affiliations

Hitachi (Japan)(Current)

Karlsruhe Institute of Technology

Bao Ngoc An is an author at Hitachi (Japan) specializing in microstructure, engineering, and sintering.

Top concepts

SinteringEngineeringMicrostructureMaterial ScienceElectronic PackagingMaterials EngineeringCorrosionHeat TransferApplied PhysicsCeramic Powders

Publications per year

2018–2020

2

Publications

2

Copper Die-Bonding Sinter Paste: Sintering and Bonding Properties

Dai Ishikawa, Hideo Nakako, Yuki Kawana et al. · 2018 7th Electronic System-Integration Technology Conference (ESTC) · 2018 · 26 citations

Engineering, Bonding Properties, Cu Sinter Paste +17

Bonding Strength of Cu Sinter Die-Bonding Paste on Ni, Cu, Ag, and Au Surfaces under Pressureless Bonding Process

Dai Ishikawa, Bao Ngoc An, Matthias Mail et al. · Transactions of The Japan Institute of Electronics Packaging · 2020 · 25 citations · Full text

Engineering, Mechanical Engineering, Molecular Dynamics +18

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