F. C. Classe

Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging

Chong Leong Gan, EK Ng, B. L. Chan et al. · Journal of Nanomaterials · 2012 · 48 citations · Full text

Engineering, Nanoelectronics Device Packaging, Bondpad Cratering +22

Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging

Chong Leong Gan, EK Ng, B. L. Chan et al. · Journal of Nanomaterials · 2013 · 29 citations · Full text

Pdcu Wires, Imc Growth, Engineering +17

Effects of Bonding Wires and Epoxy Molding Compound on Gold and Copper Ball Bonds Intermetallic Growth Kinetics in Electronic Packaging

Chong Leong Gan, F. C. Classe, B. L. Chan et al. · Journal of Electronic Materials · 2014 · 25 citations

Materials Science, Materials Engineering, Electromigration Technique +10

Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array

Chong Leong Gan, F. C. Classe, U. Hashim · Microelectronics International · 2013 · 20 citations

Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +17

Long term isothermal reliability of copper wire bonded to thin 6.5 µm aluminum

F. C. Classe, Sesha Gaddamraja · 2011 · 14 citations

Engineering, Mechanical Engineering, Copper Wire +17