Concepedia

EK Ng

EN

Statistics

Publications

4

Citations

114

H-Index

4

Active since

2012

Affiliations

Universiti Malaysia Perlis(Current)

Penang Development Corporation

EK Ng is an author at Universiti Malaysia Perlis specializing in materials science, microelectronics, and engineering.

Top concepts

EngineeringApplied PhysicsMaterial ScienceMicroelectronicsElectronic PackagingElectrical EngineeringCorrosionNanomaterialsNanotechnologyAdvanced Packaging

Publications per year

2012–2013

4

Publications

4

Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging

Chong Leong Gan, EK Ng, B. L. Chan et al. · Journal of Nanomaterials · 2012 · 48 citations · Full text

Engineering, Nanoelectronics Device Packaging, Bondpad Cratering +22

Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging

Chong Leong Gan, EK Ng, B. L. Chan et al. · Journal of Nanomaterials · 2013 · 29 citations · Full text

Pdcu Wires, Imc Growth, Engineering +17

Wearout reliability study of Cu and Au wires used in flash memory fine line BGA package

EK Ng, B. L. Chan, T. Kwuanjai et al. · 2012 · 20 citations

Reliability Study, Engineering, Cu Wire Bond +21

Reliability challenges of Cu wire deployment in flash memory packaging

EK Ng, B. L. Chan, U. Hashim · 2012 · 17 citations

Materials Engineering, Materials Science, Electrical Engineering +15

1–4 of 4