B. L. Chan

Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging

Chong Leong Gan, EK Ng, B. L. Chan et al. · Journal of Nanomaterials · 2012 · 49 citations · Full text

Engineering, Electrical Engineering, Materials Engineering +17

Insulin-stimulated release of lipoprotein lipase by metabolism of its phosphatidylinositol anchor

B. L. Chan, E Rodriguez-Boulan, A R Saltiel · Science · 1988 · 49 citations

Life Sciences, Biochemistry, Cell Biology +17

Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging

Chong Leong Gan, EK Ng, B. L. Chan et al. · Journal of Nanomaterials · 2013 · 29 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Effects of Bonding Wires and Epoxy Molding Compound on Gold and Copper Ball Bonds Intermetallic Growth Kinetics in Electronic Packaging

Chong Leong Gan, F. C. Classe, B. L. Chan et al. · Journal of Electronic Materials · 2014 · 25 citations

Natural Sciences, Materials Engineering, Materials Science +11

The influence of curing systems on the properties of natural rubber

B. L. Chan, D. J. Elliott, M. Holley et al. · Journal of Polymer Science Polymer Symposia · 1974 · 22 citations

Natural Sciences, Materials Engineering, Materials Science +17